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8d

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Instrument-agnostic quality analytics for semiconductor packaging materials (underfill) — MSA, Cpk, SPC, supplier CoA trust, raw→product prediction, data-filled 8D/SCAR 반도체 패키징 소재(언더필) 품질 분석 앱 — 장비 자동 인식, MSA·공정능력·SPC, 공급사 CoA 검증, 8D·SCAR 자동 작성

  • Updated Nov 14, 2026
  • Python

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